Apply to Exhibit

Apply to Exhibit

Apply to Exhibit


Simply follow these 3 easy steps

1.  View FloorPlan and Select Booth Loccation

2.  Submit online Application

3.  Email/Fax the signed form to SEMI JAPAN


Booth Fee & Payment Due

Click Here.


Application Schedule

Onsite-booth Selection

December 12-14, 2018

in Special meeting room  (OSS Office)

1st Exhibiotr Applications

January 4 - July 31, 2019

exhibitors choose a booth location

2nd Exhibiotr Applications

after July 31, 2019

exhibitors choose a booth location


Event Overview: SEMICON Japan 2019

SEMICON Japan 2019

December 11-13, 2019
Tokyo Big Sight, West Hall, South Hall, Conference Tower


Main Exhibit Zone

Front-End Process Zone

  • Design Tools
  • Wafer Manufacturing Equipment
  • Wafer Process Equipment

Components & Materials Zone

Back-end / Overall Process Zone

  • Packaging Equipment
  • Test & Inspection Equipment
  • Fab Facility & Related Equipment
  • Fab & Packaging Materials
  • Softwares & Services



IoT solution, application, device, equipment, components, software and service providers and manufacturers in the following areas:

  • Smart Manufacturing
  • Smart Automotive


Pavilion Exhibit Zone 

 Manufacturing Innovation Pavilion

  • Advanced Lithography: EUV, nanoimprint, DSA, multi-patterning
  • Advanced mounting technology, 2.5d, 3D IC: TSV, plating
  • Production management systems & solutions: Defect control and inspections, yield management, automation
  • Precision work technology, special materials: Non-magnetic, lightweight, heat-resistant, corrosion-proof, particle countermeasures
  • Flexible electronics, OLED, LED, and related technologies: Manufacturing technologies, devices, materials


For inquiries, contact:

SEMI Japan Customer Services

Tel: +81. 3.3222.5988


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